• DocumentCode
    2997973
  • Title

    Three-layer ferroelectrets from perforated Teflon®-PTFE films fused between two homogeneous Teflon®-FEP films

  • Author

    Basso, H.C. ; Alta, R.A.P. ; Mellinger, Axel ; Fang, W.P.W. ; Gerhard, Reimund

  • Author_Institution
    Univ. of Sao Paulo Sao Carlos, Sao Carlos
  • fYear
    2007
  • fDate
    14-17 Oct. 2007
  • Firstpage
    453
  • Lastpage
    456
  • Abstract
    In this contribution, we propose a new route towards polymer ferroelectrets with uniform voids: Two homogeneous Teflonreg-FEP films are separated by, but also thermally fused to a Teflonreg-PTFE film with several homogeneous holes. Closed voids with FEP top and bottom lids and PTFE walls are dius formed. After internally charging the top and bottom FEP layers with positive and negative polarity, respectively, the voids constitute large dipoles that can be deformed by mechanical or electrical stresses. Consequently, the three-layer sandwich exhibits direct and inverse piezoelectricity. The continuous layer-fusing process involves a press with hot cylindrical rolls that operate at temperatures up to 310degC, which may allow production of inexpensive transducer materials on a large scale. We report about the concept, the processing, the charging and the electromechanical performance of the three-layer ferroelectrets.
  • Keywords
    electrets; ferroelectric materials; ferroelectric thin films; multilayers; piezoelectricity; polymer films; sandwich structures; voids (solid); PTFE; closed voids; electrical stresses; electromechanical performance; mechanical stresses; piezoelectricity; polymer ferroelectrets; temperature 310 degC; three-layer ferroelectrets; three-layer sandwich; Biological materials; Dielectric materials; Dielectrics and electrical insulation; Electrets; Optical films; Physics; Piezoelectric films; Piezoelectric transducers; Polymer films; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-1482-6
  • Electronic_ISBN
    978-1-4244-1482-6
  • Type

    conf

  • DOI
    10.1109/CEIDP.2007.4451625
  • Filename
    4451625