Three-dimensional modeling of wire sweep incorporating resin cure

Author

Wu, J.H. ; Tay, A.A.O. ; Yeo, K.S. ; Lim, T.B.

Author_Institution

Inst. of Microelectron., Singapore

fYear

1996

fDate

28-31 May 1996

Firstpage

1047

Lastpage

1055

Abstract

In this paper, a fully three-dimensional model is introduced for the simulation of wire sweep during cavity filling in transfer molding of IC packaging. This includes the composite segment functions for defining spatial wirebond geometry, a singularly numerical integration for calculating flow-induced forces on wirebonds and a three-dimensional penalty finite element technique for simulating molding compound flow. The wire sweep of a 26-leaded device with a die at a given transfer time and molding temperature is studied. The wirebond behavior is investigated in terms of local velocity field and molding compound viscosity etc. The effects of the process conditions, such as transfer time, transfer rate and molding temperature, on wire sweep are also discussed

Keywords

encapsulation; finite element analysis; integrated circuit modelling; integrated circuit packaging; lead bonding; plastic packaging; IC packaging; cavity filling; composite segment functions; finite element technique; flow-induced forces; local velocity field; molding compound viscosity; molding temperature; resin cure; spatial wirebond geometry; three-dimensional modeling; transfer molding; transfer time; wire sweep; Filling; Finite element methods; Geometry; Integrated circuit modeling; Integrated circuit packaging; Resins; Solid modeling; Temperature; Transfer molding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550811

Filename

550811