Title :
Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package
Author :
Czernohorsky, Julia ; Maj, Bartosz ; Viering, Matthias ; Wright, Lance ; Balanon, Gerry
Author_Institution :
Continental Teves AG, Frankfurt
Abstract :
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
Keywords :
application specific integrated circuits; integrated circuit packaging; microassembling; polymers; solders; thermal management (packaging); ASIC; epoxy die attach; heat sources; package assembly; power package; solder die attach; thermal investigation; Assembly; Diodes; Electronic design automation and methodology; Electrostatic discharge; Microassembly; Packaging; Performance evaluation; Power measurement; Temperature measurement; Temperature sensors;
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
DOI :
10.1109/THERMINIC.2007.4451743
