DocumentCode
2999436
Title
Dependency of heat transfer rate on the Brinkman number in microchannels
Author
Park, Hee Sung
Author_Institution
Univ. of Limerick, Limerick
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
61
Lastpage
65
Abstract
Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate is crucial in design of microscale cooling device but is not clearly understood yet. This work proposes a new correlation between heat transfer rate and Brinkman number which is nondimensional number of viscosity, flow velocity and temperature. Our experimental results showed a good empirical equation that Nu/(Re0.62 Pr0.33) is inversely proportional to the Brinkman number in laminar flow regime. It is expected that the equation proposed by this work can be useful to design microchannel cooling device.
Keywords
design; laminar flow; microchannel flow; viscosity; Brinkman number; electronics; flow velocity; heat generation; heat transfer rate; high-density integrated circuit technology; laminar flow; microchannels; microscale cooling device design; Biomedical engineering; Data analysis; Electronics cooling; Equations; Friction; Heat transfer; Integrated circuit technology; Microchannel; Microfluidics; Thin film sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451748
Filename
4451748
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