DocumentCode
2999453
Title
The effect of ultrasonic frequency on fine pitch aluminum wedge wirebond
Author
Gonzalez, Bill ; Knecht, Sheera ; Handy, Howard ; Ramirez, Jose
Author_Institution
Digital Equipment Corp., Hudson, MA, USA
fYear
1996
fDate
28-31 May 1996
Firstpage
1078
Lastpage
1087
Abstract
This paper describes an analysis of the effect of ultrasonic frequency on aluminum wedge bonds. Wire tensile strength, initial bond force, and ultrasonic power were varied for processes using a standard 60 kHz and a new 120 kHz transducer. Responses measured included wire pull strength and the probability of wire pull lifts, bond width, and bond pad metal “splash”. A comparison was made between the two transducers using the methods of designed experiments
Keywords
aluminium; fine-pitch technology; lead bonding; tensile strength; ultrasonic welding; 120 kHz; 60 kHz; Al; Al wedge wirebond; US transducers; bond pad metal splash; bond width; fine pitch wirebond; initial bond force; tensile strength; ultrasonic frequency; ultrasonic power; wire pull lifts; wire pull strength; Aluminum; Bonding forces; Design methodology; Frequency; Manufacturing industries; Manufacturing processes; Semiconductor device manufacture; Ultrasonic transducers; Ultrasonic variables measurement; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.550816
Filename
550816
Link To Document