DocumentCode :
2999839
Title :
Evaluation of cooling solutions for outdoor electronics
Author :
Wankhede, Mahendra ; Khaire, Vivek ; Goswami, Avijit ; Mahajan, S.D.
Author_Institution :
Appl. Thermal Technol. India, Pune
fYear :
2007
fDate :
17-19 Sept. 2007
Firstpage :
162
Lastpage :
167
Abstract :
The thermal management of an outdoor electronic enclosure can be quite challenging due to the additional thermal load from the sun and the requirement of having an air-sealed enclosure. It is essential to consider the effect of solar heating loads in the design process; otherwise, it can shorten the life expectancy of the electronic product or lead to catastrophic failure. The main objective of this work is to analyze and compare the effectiveness of different cooling techniques used for outdoor electronics. Various cooling techniques were compared like special coats and paints on the outer surface, radiation shield, double-walled enclosure, fans for internal air circulation and air-to-air heat exchangers. A highly simplified, typical outdoor system was selected for this study measuring approximately 300times300times400 mm (WxLxH). Solar radiation was incident on 3 sides of the enclosure. There were 8 equally spaced PCBs inside the enclosure dissipating 12.5 W each uniformly (100 watts total). A computational fluid dynamics (CFD) model of the system was built and analyzed. This was followed by building a mock-up of the system and conducting experiments to validate the CFD model. It was found that some of the simplest cooling techniques like white oil paint on the outer surface can significantly reduce the impact of solar loads. Adding internal circulation fans can also be very effective. Using air-to-air heat exchangers was found to be the most effective solution although it is more complex and costly.
Keywords :
computational fluid dynamics; cooling; thermal management (packaging); air-sealed enclosure; air-to-air heat exchangers; cooling solutions; design process; double-walled enclosure; electronic product; internal air circulation; outdoor electronic enclosure; outdoor electronics; radiation shield; solar heating; thermal management; Computational fluid dynamics; Electronics cooling; Fans; Paints; Process design; Solar heating; Sun; Thermal loading; Thermal management; Thermal management of electronics; Thermal management; electronics cooling; outdoor cooling; solar loading;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-2-35500-002-7
Type :
conf
DOI :
10.1109/THERMINIC.2007.4451770
Filename :
4451770
Link To Document :
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