Environmental leadership in electronics manufacturing: lead-free and beyond

Author

Shangguan, Dongkai

Author_Institution

Flextronics, San Jose, CA, USA

fYear

2004

fDate

10-13 May 2004

Firstpage

33

Lastpage

39

Abstract

This paper reviews the strategy and methodology for meeting the challenges of environmental leadership for the transition to WEEE/RoHS compliance in electronics manufacturing, including the key compatibility issues involved in lead-free soldering, supply chain compliance, compliance assurance management, design for the environment, and recycling for product end-of-life management.

Keywords

circuit reliability; design for environment; electronics industry; electronics packaging; printed circuit manufacture; recycling; reflow soldering; reviews; solders; wave soldering; WEEE/RoHS compliance; compatibility issues; compliance assurance management; design for environment; electronics manufacturing; environmental leadership; functional signature analysis methodology; hazardous substances; lead-free soldering; product end-of-life management; recycling; reflow soldering; remaining life; rework processes; solderability; supply chain compliance; wave soldering; Costs; Electronic waste; Environmental management; Environmentally friendly manufacturing techniques; Gold alloys; Laminates; Lead; Recycling; Soldering; Supply chain management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 2004. Conference Record. 2004 IEEE International Symposium on

ISSN

1095-2020

Print_ISBN

0-7803-8250-1

Type

conf

DOI

10.1109/ISEE.2004.1299684

Filename

1299684