• DocumentCode
    2999953
  • Title

    Dynamic electrothermal simulation of integrated resistors at device level

  • Author

    Vermeersch, Bjorn ; De Mey, Gilbert

  • Author_Institution
    Ghent Univ., Ghent
  • fYear
    2007
  • fDate
    17-19 Sept. 2007
  • Firstpage
    196
  • Lastpage
    201
  • Abstract
    This paper presents the dynamic electrothermal simulation of a rectangular resistor integrated on a semiconductor substrate. Due to the temperature dependence of the electrical conductivity of the resistive sheet, self heating provokes a coupling between the electrical and thermal problem and gives rise to nonlinear phenomena. We introduce a time stepping iterative method to perform the calculations. The electrical and thermal solvers are based on FEM and Green´s functions techniques respectively. An extensive dynamic analysis of the device will be presented. The results include heating and cooling curves, Nyquist plot (complex locus) of the thermal impedance, time constant spectrum and structure function. Comparisons with the linear case, i.e. a temperature independent resistor, are made and accompanied by analytical approximations if possible. One key observation is that the nonlinearity may easily be overlooked: its detection is only possible in particular characteristics.
  • Keywords
    Green´s function methods; electrical conductivity; finite element analysis; integrated circuits; iterative methods; resistors; FEM; Green´s functions; dynamic electrothermal simulation; electrical conductivity; integrated resistors; rectangular resistor; self heating; temperature independent resistor; thermal impedance; time stepping iterative method; Couplings; Electrothermal effects; Green´s function methods; Iterative methods; Resistance heating; Resistors; Substrates; Temperature dependence; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-2-35500-002-7
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2007.4451777
  • Filename
    4451777