DocumentCode
3000007
Title
Optimal sensor configuring techniques for the compensation of thermo-elastic deformations in high-precision systems
Author
Koevoets, A.H. ; Eggink, H.J. ; van der Sanden, J. ; Dekkers, J. ; Ruijl, T.A.M.
Author_Institution
Philips Appl. Technol., Eindhoven
fYear
2007
fDate
17-19 Sept. 2007
Firstpage
208
Lastpage
213
Abstract
The time dependent thermal behaviour of precision systems and processes in relation to positioning accuracy is an important aspect and often claims a large part of the available position budged. This problem can be dealt with using real-time error-compensation method that combines measured temperatures with knowledge of thermo-elastic properties of the precision system. The thermally induced time varying deformations are calculated real-time by the error compensation model based on measured temperatures. The gained performance depends on the uncertainty of the thermo-mechanical model, the configuration of the temperature sensors and uncertainties in the temperature measurements. In the paper a method is introduced that enables optimization of the sensor configuration and accompanying compensation model based on the modal reduction technique. This method can be used in cases where only little pre-knowledge of heat-loads are available and enables a more optimal sensor placement, thus improving the performance of the error-compensation method.
Keywords
elastic deformation; error compensation; measurement uncertainty; precision engineering; temperature measurement; temperature sensors; thermoelasticity; high-precision systems; modal reduction technique; optimal sensor configuration techniques; real-time error-compensation method; temperature measurement uncertainty; temperature sensors; thermo-elastic deformations; Deformable models; Error compensation; Optimization methods; Real time systems; Sensor systems; Temperature measurement; Temperature sensors; Thermal sensors; Thermomechanical processes; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigation of ICs and Systems, 2007. THERMINIC 2007. 13th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-2-35500-002-7
Type
conf
DOI
10.1109/THERMINIC.2007.4451779
Filename
4451779
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