• DocumentCode
    3000246
  • Title

    A novel methodology on tuning work function of metal gate using stacking bi-metal layers

  • Author

    Jeon, I.S. ; Lee, J. ; Zhao, P. ; Sivasubramani, P. ; Oh, T. ; Kim, H.J. ; Cha, D. ; Huang, J. ; Kim, M.J. ; Gnade, B.E ; Kim, J. ; Wallace, R.M.

  • Author_Institution
    Dept. of Electr. Eng., Texas Univ., Dallas, TX, USA
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    303
  • Lastpage
    306
  • Abstract
    We demonstrate that the work function of a metal gate can be varied by inserting a very thin metal layer ("metal A") between a thick metal ("metal B") and the gate dielectric. The flat band voltage (VFB) of the MOS (metal-oxide-semiconductor) capacitor structure can be controlled within the range bounded by metal A and metal B individually, as demonstrated with various stacked bi-metal layers. For continuous thin layers, we speculate that the work function tunability may be due to the drastic change of the electron density in the thin continuous metal layer in direct contact with a bulk metal. This drastic change of electron density results in a larger junction depth than that expected for a bulk metal. Non-uniform thin layers also appear effective for work function tuning as well, and the observed VFB shift is attributed to the metal island formation at the dielectric/metal A interface.
  • Keywords
    MIS devices; dielectric materials; electron density; interface structure; sputter deposition; transmission electron microscopy; work function; bimetal layer stacking; electron density; flat band voltage; gate dielectric; interface layer; metal gate; metal island formation; metal layer; metal oxide semiconductor capacitor structure; work function tunability; Alloying; Capacitance-voltage characteristics; Channel bank filters; Dielectric substrates; Electrodes; Electronic mail; Electrons; MOS capacitors; Stacking; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419139
  • Filename
    1419139