DocumentCode
3000768
Title
A modeling approach for correlation´s evolution of modular product family
Author
Yang, Yue ; Wang, Xibin
Author_Institution
Sch. of Mech. & Vehicular Eng., Beijing Inst. of Technol., Beijing, China
fYear
2009
fDate
26-29 Nov. 2009
Firstpage
1084
Lastpage
1089
Abstract
Modular design is a systematic design method, which needs modeling technology to prepare framework for construction and evolution of product system. In this paper, a multi-view modeling methodology is proposed to prepare such an structure for correlation´s evolution of product family based on relationship constraint network. According to evolutionary process of modular design, demands of modeling techniques are analysed firstly. Secondly, through comparing interface propagation in specific view with network, correlative information among elements is organized in the form of constraint network. In this way, correlative information of product is organized into a tri-view model, which includes the functional, the structural and the behavioral. Based on the tri-view model, model of product family is established by modular layouts, and provides a two-way channel for application and optimization of modular scheme. Finally, a case is presented to illustrate the application of the proposed approach, which proved the effectiveness of this approach.
Keywords
evolutionary computation; product design; production engineering computing; correlation evolution; evolutionary process; modular design; modular product family; multiview product modeling; relationship constraint network; Collaboration; Control systems; Design engineering; Design methodology; Design optimization; Engines; Modular construction; Multiagent systems; Process control; Process design; Correlation´s evolution; Modular design; Multi-view Product Modeling; Product Family Modeling; Relationship Constraint Network;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Industrial Design & Conceptual Design, 2009. CAID & CD 2009. IEEE 10th International Conference on
Conference_Location
Wenzhou
Print_ISBN
978-1-4244-5266-8
Electronic_ISBN
978-1-4244-5268-2
Type
conf
DOI
10.1109/CAIDCD.2009.5375266
Filename
5375266
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