Polymer based technologies for microwave and millimeterwave applications

Author

Grenier, K. ; Dubuc, D. ; Mazenq, L. ; Ducarouge, B. ; Bouchriha, F. ; Rennane, A. ; Pons, P. ; Plana, R. ; Busquére, J.P. ; Lubecke, V. ; Ancey, P.

Author_Institution

LAAS-CNRS, Toulouse, France

fYear

2004

fDate

13-15 Dec. 2004

Firstpage

545

Lastpage

548

Abstract

Thanks to very interesting electrical, mechanical and thermal characteristics, polymers are getting particularly attractive in microwave and millimeterwave applications. This paper gives an overview of different possible polymer implementation in high frequency circuits, from the minimization of circuits´ losses up to 3D integration of the future communication systems. Allied to MEMS technologies, intelligent modules with high compactness and reconfigurability become possible.

Keywords

microwave devices; millimetre wave devices; polymers; 3D integration; MEMS technologies; circuits losses minimization; future communication systems; high compactness characteristics; high frequency circuits; intelligent modules; microwave application; millimeterwave applications; polymer based technologies; reconfigurability characteristic; Circuits; Dielectric losses; Dielectric substrates; Electronic packaging thermal management; Frequency; Microwave technology; Minimization; Optical losses; Polymers; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International

Print_ISBN

0-7803-8684-1

Type

conf

DOI

10.1109/IEDM.2004.1419216

Filename

1419216