• DocumentCode
    3002345
  • Title

    Frequency-dependent simulation of volume conduction in a linear model of the implanted cochlea

  • Author

    Inguva, Chidrupi ; Wong, Paul ; Sue, Andrian ; McEwan, Alistair ; Carter, Paul

  • Author_Institution
    Sch. of Electr. Eng., Univ. of Sydney, Sydney, NSW, Australia
  • fYear
    2015
  • fDate
    22-24 April 2015
  • Firstpage
    426
  • Lastpage
    429
  • Abstract
    Volume conduction models of the implanted cochlea are useful tools for investigating cochlear implant function. To date, however, all existing models have assumed that the tissues of the cochlea are purely resistive, despite evidence to the contrary. In this paper, a preliminary attempt to incorporate frequency-dependent effects is made using a simple, extruded finite element model of the cochlea. It was found that resistive and dispersive formulations exhibited marked differences in the pattern of current flow, especially later in the phase. The scala tympani response remained largely resistive as per published experimental evidence. However, injected current was also diverted away from higher impedance bone and neural tissue towards lower impedance pathways, particularly the cerebrospinal fluid in the modiolus. Further investigation of these effects is warranted to better understand these differences and how they might affect existing models of neural excitation.
  • Keywords
    biological tissues; bone; cochlear implants; ear; finite element analysis; hearing; orthopaedics; prosthetics; cerebrospinal fluid; cochlea tissues; current flow pattern; finite element model; frequency-dependent simulation; high impedance bone; impedance pathways; implanted cochlea; linear model; neural excitation; neural tissue; scala tympani response; volume conduction models; Computational modeling; Conductivity; Dispersion; Electrodes; Mathematical model; Permittivity; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Neural Engineering (NER), 2015 7th International IEEE/EMBS Conference on
  • Conference_Location
    Montpellier
  • Type

    conf

  • DOI
    10.1109/NER.2015.7146650
  • Filename
    7146650