• DocumentCode
    3002376
  • Title

    Highly scalable nonvolatile resistive memory using simple binary oxide driven by asymmetric unipolar voltage pulses

  • Author

    Baek, I.G. ; Lee, M.S. ; Seo, S. ; Lee, M.-J. ; Seo, D.H. ; Suh, D.-S. ; Park, J.C. ; Park, S.O. ; Kim, H.S. ; Yoo, I.K. ; Chung, U-in ; Moon, J.T.

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd., Yongin, South Korea
  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    587
  • Lastpage
    590
  • Abstract
    Simple binary-TMO (transition metal oxide) resistive random access memory named as OxRRAM has been fully integrated with 0.18μm CMOS technology, and its device as well as cell properties are reported for the first time. We confirmed that OxRRAM is highly compatible with the conventional CMOS process such that no other dedicated facility or process is necessary. Filamentary current paths, which are switched on or off by asymmetric unipolar voltage pulses, made the cell properties insensitive to cell or contact size promising high scalability. Also, OxRRAM showed excellent high temperature performance, even working at 300°C without any significant degradation. With optimized TMO material and electrodes, OxRRAM operated successfully under 3V bias voltage and 2mA switching current at a TMO cell size smaller than 0.2μm2.
  • Keywords
    CMOS integrated circuits; random-access storage; transition metal compounds; 0.18 micron; 2 mA; 3 V; 300 C; CMOS technology; OxRRAM; TMO cell; TMO material optimization; asymmetric unipolar voltage pulses; filamentary current path; highly scalable nonvolatile resistive memory; simple binary TMO resistive random access memory; transition metal oxide; CMOS process; CMOS technology; Electrodes; Moon; Nonvolatile memory; Organic materials; Semiconductor films; Switches; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419228
  • Filename
    1419228