• DocumentCode
    3004525
  • Title

    Modeling and layout optimization of VLSI devices and interconnects in deep submicron design

  • Author

    Cong, Jason

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    1997
  • fDate
    28-31 Jan 1997
  • Firstpage
    121
  • Lastpage
    126
  • Abstract
    This paper presents an overview of recent advances on modeling and layout optimization of devices and interconnects for high-performance VLSI circuit design under the deep submicron technology. First, we review a number of interconnect and driver/gate delay models, which are most useful to guide the layout optimization. Then, we summarize the available performance optimization techniques for VLSI device and interconnect layout, including driver and transistor sizing, transistor ordering, interconnect topology optimization, optimal wire sizing, optimal buffer placement, and simultaneous topology construction, buffer insertion, buffer and wire sizing. The efficiency and impact of these techniques will be discussed in the tutorial
  • Keywords
    VLSI; buffer circuits; circuit layout CAD; circuit optimisation; delays; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; network topology; VLSI devices; buffer insertion; deep submicron design; driver/gate delay models; high-performance VLSI circuit design; interconnect topology optimization; interconnects; layout optimization; optimal buffer placement; optimal wire sizing; simultaneous topology construction; transistor ordering; transistor sizing; Capacitance; Circuit synthesis; Computer science; Delay estimation; Design optimization; Driver circuits; Integrated circuit interconnections; Topology; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
  • Conference_Location
    Chiba
  • Print_ISBN
    0-7803-3662-3
  • Type

    conf

  • DOI
    10.1109/ASPDAC.1997.600085
  • Filename
    600085