DocumentCode
3004525
Title
Modeling and layout optimization of VLSI devices and interconnects in deep submicron design
Author
Cong, Jason
Author_Institution
Dept. of Comput. Sci., Univ. of Southern California, Los Angeles, CA, USA
fYear
1997
fDate
28-31 Jan 1997
Firstpage
121
Lastpage
126
Abstract
This paper presents an overview of recent advances on modeling and layout optimization of devices and interconnects for high-performance VLSI circuit design under the deep submicron technology. First, we review a number of interconnect and driver/gate delay models, which are most useful to guide the layout optimization. Then, we summarize the available performance optimization techniques for VLSI device and interconnect layout, including driver and transistor sizing, transistor ordering, interconnect topology optimization, optimal wire sizing, optimal buffer placement, and simultaneous topology construction, buffer insertion, buffer and wire sizing. The efficiency and impact of these techniques will be discussed in the tutorial
Keywords
VLSI; buffer circuits; circuit layout CAD; circuit optimisation; delays; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; network topology; VLSI devices; buffer insertion; deep submicron design; driver/gate delay models; high-performance VLSI circuit design; interconnect topology optimization; interconnects; layout optimization; optimal buffer placement; optimal wire sizing; simultaneous topology construction; transistor ordering; transistor sizing; Capacitance; Circuit synthesis; Computer science; Delay estimation; Design optimization; Driver circuits; Integrated circuit interconnections; Topology; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location
Chiba
Print_ISBN
0-7803-3662-3
Type
conf
DOI
10.1109/ASPDAC.1997.600085
Filename
600085
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