Title :
Plastic packaging of semiconductor laser diodes
Author :
Fukuda, Mitsuo ; Ichikawa, Fumio ; Sato, Hirotsugu ; Hibino, Yoshinori ; Moriwaki, Kazuyuki ; Tohno, Shunichi ; Sugie, Toshihiko ; Yoshida, Junichi
Author_Institution :
NTT Opto-Electron. Labs., Kanagawa, Japan
Abstract :
Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems
Keywords :
environmental testing; modules; optical communication equipment; plastic packaging; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; semiconductor lasers; board type; coaxial type; endurance tests; environmental tests; high reliability; low cost optical sources; plastic molded laser modules; plastic packaging; semiconductor laser diodes; transmission systems; Coaxial components; Costs; Diode lasers; Fiber lasers; Laser radar; Optical fibers; Plastic packaging; Semiconductor lasers; Testing; Waveguide lasers;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550875
