Plastic packaging of semiconductor laser diodes

Author

Fukuda, Mitsuo ; Ichikawa, Fumio ; Sato, Hirotsugu ; Hibino, Yoshinori ; Moriwaki, Kazuyuki ; Tohno, Shunichi ; Sugie, Toshihiko ; Yoshida, Junichi

Author_Institution

NTT Opto-Electron. Labs., Kanagawa, Japan

fYear

1996

fDate

28-31 May 1996

Firstpage

1101

Lastpage

1108

Abstract

Two kinds of plastic molded laser modules, the coaxial type and the board type, are developed aiming at lower cost laser modules. Under various environmental and endurance tests, these modules show potential for high reliability. The performance of these modules seem comparable to that of hermetically sealed modules used in commercial transmission systems. They are potentially suitable for low cost optical sources in transmission systems

Keywords

environmental testing; modules; optical communication equipment; plastic packaging; semiconductor device packaging; semiconductor device reliability; semiconductor device testing; semiconductor lasers; board type; coaxial type; endurance tests; environmental tests; high reliability; low cost optical sources; plastic molded laser modules; plastic packaging; semiconductor laser diodes; transmission systems; Coaxial components; Costs; Diode lasers; Fiber lasers; Laser radar; Optical fibers; Plastic packaging; Semiconductor lasers; Testing; Waveguide lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550875

Filename

550875