• DocumentCode
    3005215
  • Title

    Simulation of high-temperature millisecond annealing-based on atomistic modeling of boron diffusion/activation in silicon

  • Author

    Hane, M. ; Ikezawa, T. ; Matsuda, Tadamitsu ; Shishiguchi, S.

  • fYear
    2004
  • fDate
    13-15 Dec. 2004
  • Firstpage
    975
  • Lastpage
    978
  • Abstract
    An advanced annealing technique.where high temperature is applied for a ~ f ewm illiseconds was investigated through an atomistic process simulation program. In this basic study into the feasibility of this new annealing technique, our aim was to clarify what is happening under the ideal conceptual condition of high-temperature millisecond annealing.
  • Keywords
    Boron; Fitting; Ion implantation; Kinetic theory; MOSFET circuits; National electric code; Silicon; Simulated annealing; Temperature; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8684-1
  • Type

    conf

  • DOI
    10.1109/IEDM.2004.1419349
  • Filename
    1419349