DocumentCode
3005215
Title
Simulation of high-temperature millisecond annealing-based on atomistic modeling of boron diffusion/activation in silicon
Author
Hane, M. ; Ikezawa, T. ; Matsuda, Tadamitsu ; Shishiguchi, S.
fYear
2004
fDate
13-15 Dec. 2004
Firstpage
975
Lastpage
978
Abstract
An advanced annealing technique.where high temperature is applied for a ~ f ewm illiseconds was investigated through an atomistic process simulation program. In this basic study into the feasibility of this new annealing technique, our aim was to clarify what is happening under the ideal conceptual condition of high-temperature millisecond annealing.
Keywords
Boron; Fitting; Ion implantation; Kinetic theory; MOSFET circuits; National electric code; Silicon; Simulated annealing; Temperature; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-8684-1
Type
conf
DOI
10.1109/IEDM.2004.1419349
Filename
1419349
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