• DocumentCode
    3005246
  • Title

    Challenges for developing low-cost avionics/aerospace-grade optoelectronic modules

  • Author

    Chan, E.Y. ; Beranek, M.W. ; Davido, K.W. ; Hager, H.E. ; Hong, C.S. ; Pierre, R. L St

  • Author_Institution
    Res. & Technol., Boeing Defense & Space Group, Seattle, WA, USA
  • fYear
    1996
  • fDate
    28-31 May 1996
  • Firstpage
    1122
  • Lastpage
    1129
  • Abstract
    The commercial and military avionics/aerospace environment presents formidable challenges for developing and manufacturing low-cost avionics/aerospace-grade optoelectronic modules. Because manufacturing volume is relatively low, the economies of scale advantage enjoyed by commercial datacom optoelectronic module producers has yet to be realized. Currently the harsh avionics/aerospace environment obligates the hybrid designer to place highest priority on achieving very high performance and reliability, thus imposing stringent constraints for implementing potentially low-cost optoelectronic module designs in today´s military/aerospace hybrid manufacturing plant. Boeing´s collaborative R&D programs with commercial sector optoelectronics producers provides a solution for reducing optoelectronic module design and manufacturing production costs for future avionics/aerospace optoelectronic module applications
  • Keywords
    aerospace instrumentation; assembling; avionics; electronic equipment manufacture; modules; optoelectronic devices; packaging; aerospace-grade modules; cost reduction; low-cost avionics modules; manufacturing production costs; module design costs; optoelectronic modules; Aerospace electronics; Aerospace testing; Costs; Hardware; Light emitting diodes; Optical fiber communication; Optical fiber testing; Packaging; Seals; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1996. Proceedings., 46th
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3286-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1996.550878
  • Filename
    550878