Title :
Investigation on Via Arrangements for the Thermal Management of High Current PCBs
Author :
Coppola, Luisa ; Schmidt, Roland ; Cottet, Didier
Author_Institution :
Corp. Res., ABB Switzerland Ltd., Baden
Abstract :
Joule heating of copper traces and vias in high current PCBs can significantly deteriorate the reliability of power electronics products. Optimization of the PCB layout is therefore fundamental to guarantee the thermal performance of a converter. This paper investigates the temperature distribution of copper traces and through via holes, when number and disposition of parallel vias are changed in a standard PCB.
Keywords :
power convertors; printed circuit layout; reliability; thermal management (packaging); Joule heating; converter thermal performance; copper traces; high current PCB; power electronics products reliability; temperature distribution; thermal management; Cameras; Copper; Energy management; Heating; Power electronics; Temperature distribution; Testing; Thermal management; Thermal management of electronics; Waste management;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty-Fourth Annual IEEE
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-2811-3
Electronic_ISBN :
1048-2334
DOI :
10.1109/APEC.2009.4802702
