• DocumentCode
    3006673
  • Title

    Reliability characterization of the SLICC package

  • Author

    Lall, Pradeep ; Gold, Glenn ; Miles, Barry ; Banerji, Kingshuk ; Thompson, Pat ; Koehler, Corey ; Adhihetty, Indira

  • Author_Institution
    Adv. Manuf. Technol. Center, Motorola Inc., Plantation, FL, USA
  • fYear
    1996
  • fDate
    28-31 May 1996
  • Firstpage
    1202
  • Lastpage
    1210
  • Abstract
    SLICC (Slightly Larger than IC Carrier) is a chip-scale ball grid array (BGA) package currently under development at Motorola. The SLICC package consists of a solder-bumped integrated circuit (IC) which is flip-chip bonded to an interposer substrate-approximately 8 mils thick-and then underfilled with an encapsulant. Chip I/Os are routed to package I/Os through plated through holes (PTHs) in the interposer substrate. Package I/Os are composed of solder bumps (approx. 22.2 mils in diameter on a 32-mil pitch) attached to the bottom side of the interposer substrate. The most apparent benefit of the SLICC package is its utilization of the area efficiency associated with direct chip attach (DCA) technology, coupled with the assembly, test, and repair simplicity afforded by BGA-type packaging
  • Keywords
    failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; reflow soldering; reliability theory; thermal stress cracking; DCA technology; Motorola; PTH; SLICC package; ball grid array; chip-scale BGA package; direct chip attach technology; encapsulant; flip-chip bonding; interposer substrate; plated through holes; reliability characterization; solder joint reliability; solder-bumped integrated circuit; thermal fatigue; underfilling; Assembly; Bonding; Electronics packaging; Gold; Integrated circuit packaging; Semiconductor device packaging; Soldering; Space technology; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1996. Proceedings., 46th
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3286-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1996.550888
  • Filename
    550888