DocumentCode
3006673
Title
Reliability characterization of the SLICC package
Author
Lall, Pradeep ; Gold, Glenn ; Miles, Barry ; Banerji, Kingshuk ; Thompson, Pat ; Koehler, Corey ; Adhihetty, Indira
Author_Institution
Adv. Manuf. Technol. Center, Motorola Inc., Plantation, FL, USA
fYear
1996
fDate
28-31 May 1996
Firstpage
1202
Lastpage
1210
Abstract
SLICC (Slightly Larger than IC Carrier) is a chip-scale ball grid array (BGA) package currently under development at Motorola. The SLICC package consists of a solder-bumped integrated circuit (IC) which is flip-chip bonded to an interposer substrate-approximately 8 mils thick-and then underfilled with an encapsulant. Chip I/Os are routed to package I/Os through plated through holes (PTHs) in the interposer substrate. Package I/Os are composed of solder bumps (approx. 22.2 mils in diameter on a 32-mil pitch) attached to the bottom side of the interposer substrate. The most apparent benefit of the SLICC package is its utilization of the area efficiency associated with direct chip attach (DCA) technology, coupled with the assembly, test, and repair simplicity afforded by BGA-type packaging
Keywords
failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; microassembling; reflow soldering; reliability theory; thermal stress cracking; DCA technology; Motorola; PTH; SLICC package; ball grid array; chip-scale BGA package; direct chip attach technology; encapsulant; flip-chip bonding; interposer substrate; plated through holes; reliability characterization; solder joint reliability; solder-bumped integrated circuit; thermal fatigue; underfilling; Assembly; Bonding; Electronics packaging; Gold; Integrated circuit packaging; Semiconductor device packaging; Soldering; Space technology; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location
Orlando, FL
ISSN
0569-5503
Print_ISBN
0-7803-3286-5
Type
conf
DOI
10.1109/ECTC.1996.550888
Filename
550888
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