Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

Author

Syed, Ahmer R.

Author_Institution

Delco Electron. Corp., Kokomo, IN, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

1211

Lastpage

1216

Abstract

A combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints. The four parameters considered were: substrate thickness, array configuration, ball pitch, acid pad size. A full factorial experiment was designed which was conducted numerically. A validated life prediction model was then used to determine the fatigue lives for each combination. Up to a factor of five improvement in fatigue life is predicted when these parameters were changed from one level to another

Keywords

design of experiments; failure analysis; fatigue; finite element analysis; integrated circuit packaging; integrated circuit reliability; plastic packaging; soldering; statistical analysis; thermal stress cracking; array configuration; ball grid array packages; ball pitch; design of experiment; design parameters; full factorial experiment; life prediction model; numerical analysis; pad size; plastic BGA packages; solder joints; substrate thickness; thermal fatigue life; thermal fatigue reliability enhancement; Automotive engineering; Electronic packaging thermal management; Electronics packaging; Fatigue; Lead; Plastic packaging; Predictive models; Printed circuits; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.550889

Filename

550889