• DocumentCode
    3007322
  • Title

    Deposited oxides for high integrity applications

  • Author

    Freeman, Dean W. ; Monowski, J.R. ; Ruggles, G.A.

  • fYear
    1989
  • fDate
    12-13 Jun 1989
  • Firstpage
    503
  • Abstract
    Summary form only given. This study shows that the oxides deposited using tetraethylorthosilicate (TEOS) have electrical characteristics comparable to those of thermally grown oxides, and that TEOS-grown oxides have a lower defect density than thermal oxides grown under similar particle generating conditions. The breakdown data of TEOS films deposited at various temperatures are equivalent to those of thermal oxides of the same thickness provided that films undergo a densification step. The median breakdown field at 9 MV/cm is close to that of 9.5 MV/cm for the thermally grown control samples. Time-dependent breakdown data show TEOS deposited oxides have an order of magnitude longer lifetime than thermally grown oxides, indicating that improved reliability can be expected using a TEOS oxide
  • Keywords
    chemical vapour deposition; dielectric thin films; electric breakdown of solids; reliability; breakdown data; defect density; densification; electrical characteristics; lifetime; median breakdown field; reliability; tetraethylorthosilicate; Annealing; Capacitance-voltage characteristics; Character generation; Dielectric devices; Dielectric substrates; Electric breakdown; Electric variables; Geometry; Temperature; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
  • Conference_Location
    Santa Clara, CA
  • Type

    conf

  • DOI
    10.1109/VMIC.1989.78056
  • Filename
    78056