DocumentCode :
3007695
Title :
Oxide reliability in tungsten polycide gate electrode
Author :
Kurachi, I. ; Yanai, T. ; Yoshioka, K.
Author_Institution :
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
fYear :
1989
fDate :
12-13 Jun 1989
Firstpage :
505
Abstract :
Summary form only given. Gate oxide integrity and n-MOSFET reliability are investigated for the MOS tungsten polycide gate structure. Experimental data show that the degradation is caused by the mechanical stress in polycide film. The mechanical stress generates the traps about 50-Å depth from the gate electrode in the gate oxide. Degradation of polycide gate n-MOSFETs due to hot carriers is accelerated by the existence of these traps in the gate oxide
Keywords :
electron traps; hot carriers; insulated gate field effect transistors; reliability; MOS tungsten polycide gate structure; gate electrode; gate oxide integrity; hot carriers; mechanical stress; n-MOSFET reliability; oxide reliability; traps; Degradation; Dielectric breakdown; Dielectric substrates; Electrodes; Electron traps; MOSFET circuits; Oxidation; Silicides; Stress; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1989. Proceedings., Sixth International IEEE
Conference_Location :
Santa Clara, CA
Type :
conf
DOI :
10.1109/VMIC.1989.78058
Filename :
78058
Link To Document :
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