Title :
Molded chip scale package for high pin count
Author :
Baba, Shinji ; Tomita, Yoshihiro ; Matsuo, Mitsuyasu ; Matsushima, Hironori ; Ueda, Naoto ; Nakagawa, Osamu
Author_Institution :
IC Assembly Eng. Dept., Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
A unique molded Chip Scale Package (CSP) associated 1024 pin counts has been developed. The design and process have been optimized in order to achieve high mount density, enhanced electrical characteristic and cost competitiveness. Also, the reliability testing was performed on thermal cycling and moisture induced crack resistivity. Finally, enhanced electrical and thermal characteristics were calculated
Keywords :
integrated circuit packaging; cost competitiveness; electrical characteristic; high mount density; high pin count; moisture induced crack resistivity; molded chip scale package; reliability testing; thermal characteristics; thermal cycling; Chip scale packaging; Conductivity; Cost function; Design optimization; Electric variables; Moisture; Performance evaluation; Process design; Testing; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.550895
