Universal MEMS platforms for passive RF components: suspended inductors and variable capacitors

Author

Fan, L. ; Chen, R.T. ; Nespola, A. ; Wu, M.C.

Author_Institution

Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA

fYear

1998

fDate

25-29 Jan 1998

Firstpage

29

Lastpage

33

Abstract

We propose a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits. This platform is based on a novel surface-micromachined Micro-Elevator by Self-Assembly (MESA) technique. Both high-Q inductors and variable capacitors can be realized by the MESA technology. A surface-micromachined spiral inductor that is raised by 250 μm above the Si substrate has been experimentally demonstrated. The suspended inductor has less parasitic capacitance and substrate loss, and higher quality (Q) value and resonant frequency. The inductance of a 12.5-turn inductor is measured to be 24 nH. The results show that the self-assembled passive RF elements are suitable for monolithic integration

Keywords

capacitors; inductors; microactuators; microassembling; micromachining; passive networks; radio equipment; MESA actuators; RF integrated circuits; high-Q inductors; integrable passive components fabrication; micro-elevator by self-assembly technique; microhinges; monolithic integration; passive RF components; resonant frequency; spiral inductor; surface-micromachined; suspended inductors; universal MEMS platforms; variable capacitors; wireless communication circuits; Capacitors; Inductors; Integrated circuit technology; Micromechanical devices; Parasitic capacitance; Radio frequency; Radiofrequency integrated circuits; Resonant frequency; Self-assembly; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on

Conference_Location

Heidelberg

ISSN

1084-6999

Print_ISBN

0-7803-4412-X

Type

conf

DOI

10.1109/MEMSYS.1998.659724

Filename

659724