• DocumentCode
    3008625
  • Title

    Diamond microstructure replicas from silicon masters

  • Author

    Björkman, H. ; Rangsten, P. ; Simu, U. ; Karlsson, J. ; Hollman, P. ; Hjort, K.

  • Author_Institution
    Dept. of Mater. Sci., Uppsala Univ., Sweden
  • fYear
    1998
  • fDate
    25-29 Jan 1998
  • Firstpage
    34
  • Lastpage
    39
  • Abstract
    We are developing a microstructure technology for thick film diamond replicas, using deposition by hot filament CVD on microstructured silicon. This technology is primarily intended to make micromechanical structures for building-sets, fluidic cooling systems, systems for biochemical analyses and processes, and moulds for thermoplastic microstructures. In the thick film deposition on trenches in silicon, complete filling was possible with an aspect ratio up to 1.6. At higher aspect ratios, voids or channels are formed within the diamond replica. Ridges, trenches and capillary channels with high resolution coverage and low roughness, rms<2 nm, were created. Demonstrator structures for microfluidic, building-sets and polymer moulding applications are presented
  • Keywords
    CVD coatings; chemical vapour deposition; diamond; etching; micromachining; micromechanical devices; replica techniques; C; Si; biochemical analysis systems; building-sets; capillary channels; diamond microstructure replicas; fluidic cooling systems; high aspect ratio; hot filament CVD; microfluidics; micromachining; micromechanical structures; moulds; ridges; sacrificial etching; silicon masters; thermoplastic microstructures; thick film diamond replicas; thinning; trenches; voids; Chemical vapor deposition; Conducting materials; Crystalline materials; Hydrogen; Materials science and technology; Micromechanical devices; Microstructure; Semiconductor materials; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
  • Conference_Location
    Heidelberg
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-4412-X
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1998.659725
  • Filename
    659725