• DocumentCode
    3008959
  • Title

    Dual Wavelength Femtosecond Laser Materials Processing

  • Author

    Kamata, Masanao ; Tsujikawa, Susumu ; SUMIYOSHI, Tetusmi ; Sekita, Hitoshi

  • Author_Institution
    Cyber Laser Inc., Tokyo
  • fYear
    2007
  • fDate
    6-11 May 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Femtosecond laser ablation using the combination of 260 nm pulses and 780 nm pulses is explored for the high speed and high quality selected removal of insulating layers.
  • Keywords
    high-speed optical techniques; insulating materials; laser ablation; dual wavelength femtosecond laser materials processing; femtosecond laser ablation; high quality selected removal; high speed processing; insulating layers; wavelength 260 nm; wavelength 780 nm; Absorption; Delay effects; Insulation; Laser ablation; Materials processing; Optical materials; Optical pulses; Pulse amplifiers; Ultrafast electronics; Ultrafast optics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics, 2007. CLEO 2007. Conference on
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    978-1-55752-834-6
  • Type

    conf

  • DOI
    10.1109/CLEO.2007.4452824
  • Filename
    4452824
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3008959