• DocumentCode
    3011460
  • Title

    From spreadsheets to simulations: a comparison of analysis methods for IC manufacturing performance

  • Author

    Baudin, Michel ; Mehrotra, Vijay ; Tullis, Barclay ; Yeaman, D. ; Hughes, Randall A.

  • Author_Institution
    MTJ, Palo Alto, CA, USA
  • fYear
    1992
  • fDate
    15-16 Jun 1992
  • Firstpage
    94
  • Lastpage
    99
  • Abstract
    Illustrates the differences between spreadsheet and simulation models through the examples of diffusion cell staffing, material flows through a process segment, and the operations of a full fab. The results show that engineering judgment applied to spreadsheet outputs is not the most prudent solution when more realistic tools are available, and, that by overstating capacity, spreadsheet logic can lead to a lack of key equipment and space. Using similar input data, simulation models provide capacity estimates, as well as WIP (work in process) and cycle time predictions, which take into account the interactions between lots, machines, and people. Generally speaking, the spreadsheet model is inadequate for modeling the coordinated use of several types of resources. Until recently, the spreadsheet was still preferred in spite of its limitations because of the vast amounts of computing resources required for simulation runs. It is concluded that the advent of cheap and powerful workstations has made this a moot point
  • Keywords
    digital simulation; integrated circuit manufacture; process control; spreadsheet programs; IC manufacturing performance; WIP; analysis methods; computing resources; cycle time predictions; diffusion cell staffing; full fab; material flows; process segment; simulation models; spreadsheet models; workstations; Analytical models; Capacity planning; Computational modeling; Embedded software; Logic; Performance analysis; Performance gain; Predictive models; Production facilities; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1992. ISMSS 1992., IEEE/SEMI International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-0680-5
  • Type

    conf

  • DOI
    10.1109/ISMSS.1992.197644
  • Filename
    197644