Investigation of thermal conductivity of PCB

Author

Andonova, Anna ; Kafadarova, Nadezda ; Videkov, Valentin ; Andreev, Svetozar

Author_Institution

Dept. of Microelectron., Tech. Univ. - Sofia, Sofia, Bulgaria

fYear

2009

fDate

13-17 May 2009

Firstpage

1

Lastpage

5

Abstract

The thermal conductivity of PCB structures variations according to the position of the metal layers as a function of the local copper contents and distribution are studied. The value of the parallel and serial thermal conductivity coefficient of PCB have been calculated by usage of the corresponding electrical analogs of parallel and serial resistive systems. Solutions were obtained for two PCB thicknesses. Cases with and without a copper layer on the component side were investigated. Simulated results are verified with infrared thermovision measurements.

Keywords

electrical resistivity; printed circuits; thermal conductivity; PCB structures; infrared thermovision measurements; local copper contents; metal layers; parallel thermal conductivity coefficient; resistive systems; serial thermal conductivity coefficient; thermal conductivity; Computational fluid dynamics; Copper; Electronic components; Electronic packaging thermal management; Heat transfer; Predictive models; Semiconductor device measurement; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Conference_Location

Brno

Print_ISBN

978-1-4244-4260-7

Type

conf

DOI

10.1109/ISSE.2009.5207019

Filename

5207019