X-ray and scanning acoustic microscopy analysis on lead-free automotive electronic module

Author

Manukova, Aneliya ; Stephanov, Doychin ; Pencheva, Tamara

Author_Institution

Univ. of Rousse, Rousse, Bulgaria

fYear

2009

fDate

13-17 May 2009

Firstpage

1

Lastpage

6

Abstract

Investigation deals with development of lead-free technology for production of electronic devices for automotive industry. The purpose of this article is to present the results concerning solder joints quality evaluated by X-ray and scanning acoustic microscopy (SAM). Strong requirements for reliability in automotive industry demands high quality of solder joints of the devices. Experiments are devoted to development of lead free technology for electronic controllers. Soldering processes for the devices are realized using Sn96.5Ag3.0Cu0.5 solder paste. Tests are based on requirements of ISO/TS 16949 - Quality management system and IPC A610-D - Acceptability of Electronic Assemblies. The results are suitable for validation of products and production processes before starting mass production.

Keywords

X-ray microscopy; acoustic microscopy; automobile industry; automotive electronics; modules; reliability; soldering; solders; IPC A610-D; ISO/TS 16949; Quality Management System; Sn96.5Ag3.0Cu0.5 solder paste; SnAgCu; X-ray microscopy; electronic assemblies; leadfree automotive electronic module; reliability; scanning acoustic microscopy analysis; solder joints; Acoustic devices; Automotive electronics; Automotive engineering; Electronics industry; Environmentally friendly manufacturing techniques; Industrial electronics; Lead; Mass production; Scanning electron microscopy; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on

Conference_Location

Brno

Print_ISBN

978-1-4244-4260-7

Type

conf

DOI

10.1109/ISSE.2009.5207021

Filename

5207021