• DocumentCode
    3011698
  • Title

    Investigation of the pulse load behavior of power wire-wound resistors

  • Author

    Nicolics, Johann ; Fasching, Martin

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Vienna, Austria
  • fYear
    2009
  • fDate
    13-17 May 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A long-term resistance drift of wire-wound resistors or even a failure is frequently caused by short but repeated temperature peaks during pulse load operation. In this paper this aspect is investigated by comparison of two types of power wire-wound resistors with identical resistance value, nominal power, and size, but significantly different thermal behavior under pulse load condition. In order to capture the thermal cause as directly as possible a specific measuring circuit was developed to record the temperature as a function of time in the resistor wire during the dynamic cooling phase immediately after a pulse. In this way a peak temperature of e.g. 405degC was observed in one resistor type whereas the peak temperature in the other one at the same pulse load condition exceeded even 1000degC which is undoubtedly detrimental if periodically repeated. The measuring principle is presented in detail. The measuring accuracy is estimated and its meaning for the interpretation of the obtained results is shown. Based on these results the dependence of the pulse load resistivity of a wire-wound resistor on its interior structure is discussed. It is demonstrated that the pulse load performance can be improved significantly by increasing the thermal capacitance of the resistor wire without increasing the resistor size.
  • Keywords
    power electronics; reliability; resistors; measuring accuracy; power wire-wound resistors; pulse load condition; pulse load resistivity; resistance; thermal capacitance; Circuits; Electrical resistance measurement; Phase measurement; Pulse measurements; Resistors; Temperature; Thermal loading; Thermal resistance; Time measurement; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
  • Conference_Location
    Brno
  • Print_ISBN
    978-1-4244-4260-7
  • Type

    conf

  • DOI
    10.1109/ISSE.2009.5207023
  • Filename
    5207023