DocumentCode :
3011730
Title :
Electro ultrasonic spectroscopy of cermet thick films
Author :
Tofel, P. ; Sikula, J. ; Sedlakova, V. ; Chvatal, M.
Author_Institution :
Dept. of Phys., Univ. of Technol., Brno, Brno, Czech Republic
fYear :
2009
fDate :
13-17 May 2009
Firstpage :
1
Lastpage :
4
Abstract :
The electro-ultrasonic spectroscopy is non-destructive testing method for cermet resistors. This method can be used as a diagnostic tool for the quality and reliability assessment. AC current varying with frequency fE and the ultrasonic signal varying with frequency fU are applied on the conducting sample and a new intermodulation signal on the frequency fm given by the superposition or subtraction of exciting frequencies is measured on the sample. The sample resistance is influenced by the ultrasonic signal. The ultrasonic signal changes the contact area between the conducting grains in the sample structure and then resistance is modulated by the frequency of ultrasonic excitation. The electrical charge and also the electrical current flowing through the sample structure are conserved. In case the contact area between the conducting grains is changing then the current density is changed. This leads to the resistivity change of measured structure. We suppose that for the sample with more defects in the structure the influence of the ultrasonic signal is more pronounced and the resistance change is higher.
Keywords :
cermets; electron device testing; electronics packaging; nondestructive testing; reliability; thick film resistors; cermet thick films; current density; defects; electro-ultrasonic spectroscopy; intermodulation signal; nondestructive testing; Ceramics; Contacts; Electric resistance; Electrical resistance measurement; Frequency; Nondestructive testing; Resistors; Spectroscopy; Thick films; Ultrasonic variables measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location :
Brno
Print_ISBN :
978-1-4244-4260-7
Type :
conf
DOI :
10.1109/ISSE.2009.5207025
Filename :
5207025
Link To Document :
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