DocumentCode :
3012046
Title :
The thermal conductivity and electrical strength of epoxy resin with different filler content of micro and nano alumina
Author :
Wang Qi ; Li Zhe ; Wu Jiandong ; Yin Yi
Author_Institution :
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2012
fDate :
23-27 Sept. 2012
Firstpage :
1110
Lastpage :
1113
Abstract :
Epoxy resin is widely used in high voltage apparatus, electrical machines etc due to its excellent mechanical, electrical and chemical properties. Great progress has been made in application on electrical insulation, casting and potting. The epoxy resin containing nano-size and micro-size Al2O3 of various contents are prepared. The purpose of efforts we engaged in is to study the efforts of nano Al2O3, micro Al2O3 and nano-micro Al2O3 on the characteristics of epoxy resin on electrical and thermal properties. The epoxy resin(UVR6105) is used as the base material and Methyl six hydrogen anhydride is used as the curing agent. Various nanocomposites, microcomposites and nano-microcomposites are prepared and fabricated properly through three roller grinding machine. Breakdown strength experiments are done through JNC801 breakdown voltage tester. Nano Al2O3 enhances the electrical characteristics of epoxy resin on breakdown strength while micro Al2O3 lowers it. The thermal properties of thermal conductivity of the epoxy resin are tested through LFA477. The thermal conductivity of epoxy resin is increasing with the filling contents of the Al2O3 while there is a comparatively lower value if nano Al2O3 is added due to its high thermal interface resistance between epoxy resin and Al2O3.
Keywords :
alumina; brittleness; casting; electric breakdown; filled polymers; nanocomposites; resins; thermal conductivity; Al2O3; breakdown strength; brittleness; casting; chemical properties; electrical insulation; electrical properties; electrical strength; epoxy resin; mechanical properties; methyl six hydrogen anhydride; microalumina filler; microcomposites; nano-microcomposites; nanoalumina filler; nanocomposites; potting; roller grinding machine; thermal conductivity; thermal interface resistance; thermal properties; Aluminum oxide; Conductivity; Electric breakdown; Epoxy resins; Nanocomposites; Substrates; Thermal conductivity; Breakdown strength; Epoxy resin; Microcomposites; Nano-microcomposites; Nanocomposites; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Condition Monitoring and Diagnosis (CMD), 2012 International Conference on
Conference_Location :
Bali
Print_ISBN :
978-1-4673-1019-2
Type :
conf
DOI :
10.1109/CMD.2012.6416352
Filename :
6416352
Link To Document :
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