Title :
Technological possibilities of LTCC ceramic for field of sensors
Author :
Vehec, Igor ; Cabuk, Pavol ; Slosarcik, Stanislav ; Dovica, Miroslav
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
Abstract :
This paper is focused on shaping technology of LTCC (low temperature cofired ceramics) and their marginal possibilities in 3D shaped modules. The first part of paper deals with analysis of marginal possibilities of LTCC ceramic shaping. There were realized samples with various bending angles and various number of layers with embedded thick-film conductive paths. Applicability of obtained results was attested on development of 3D shaped module with thick-film pressure sensor.
Keywords :
bending; ceramic packaging; ceramics; firing (materials); multichip modules; pressure sensors; thick films; 3D shaped module; LTCC ceramic; bending angles; embedded thick-film conductive paths; multichip module; shaping technology; thick-film pressure sensor; Appropriate technology; Ceramics; Chemical technology; Electric variables measurement; Inspection; Lamination; Silver; Stacking; Temperature sensors; Testing;
Conference_Titel :
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location :
Brno
Print_ISBN :
978-1-4244-4260-7
DOI :
10.1109/ISSE.2009.5207054
