DocumentCode
3012335
Title
Technological possibilities of LTCC ceramic for field of sensors
Author
Vehec, Igor ; Cabuk, Pavol ; Slosarcik, Stanislav ; Dovica, Miroslav
Author_Institution
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
fYear
2009
fDate
13-17 May 2009
Firstpage
1
Lastpage
6
Abstract
This paper is focused on shaping technology of LTCC (low temperature cofired ceramics) and their marginal possibilities in 3D shaped modules. The first part of paper deals with analysis of marginal possibilities of LTCC ceramic shaping. There were realized samples with various bending angles and various number of layers with embedded thick-film conductive paths. Applicability of obtained results was attested on development of 3D shaped module with thick-film pressure sensor.
Keywords
bending; ceramic packaging; ceramics; firing (materials); multichip modules; pressure sensors; thick films; 3D shaped module; LTCC ceramic; bending angles; embedded thick-film conductive paths; multichip module; shaping technology; thick-film pressure sensor; Appropriate technology; Ceramics; Chemical technology; Electric variables measurement; Inspection; Lamination; Silver; Stacking; Temperature sensors; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on
Conference_Location
Brno
Print_ISBN
978-1-4244-4260-7
Type
conf
DOI
10.1109/ISSE.2009.5207054
Filename
5207054
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