DocumentCode :
3012446
Title :
SOI-DRAM circuit technologies for low power high speed multi-giga scale memories
Author :
Kuge, S. ; Tsuruda, T. ; Tomishima, S. ; Tsukude, M. ; Yamagata, T. ; Arimoto, K.
Author_Institution :
ULSI Lab., Mitsubishi Electr. Corp., Hyogo, Japan
fYear :
1995
fDate :
8-10 June 1995
Firstpage :
103
Lastpage :
104
Abstract :
New SOI-DRAM circuits were proposed and described. The body bias controlling technique, especially super body-synchronous sensing, is found to be suitable for low voltage operation. A new type of redundancy enables Icc2 reduction and promises high yield against the increasing standby current failure.
Keywords :
DRAM chips; redundancy; silicon-on-insulator; Icc2 reduction; SOI DRAM circuit technologies; Si; body bias controlling technique; dynamic RAM; high speed operation; low power operation; low voltage operation; multi-giga scale memories; redundancy; standby current failure; super body-synchronous sensing; Capacitance; Integrated circuit technology; Laboratories; Low voltage; P-n junctions; Random access memory; Subthreshold current; Threshold voltage; Ultra large scale integration; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Circuits, 1995. Digest of Technical Papers., 1995 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
0-7800-2599-0
Type :
conf
DOI :
10.1109/VLSIC.1995.520706
Filename :
520706
Link To Document :
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