DocumentCode
3012478
Title
MULTI-PRIDE: a system for supporting multi-layered printed wiring board design
Author
Watanabe, Toshimasa
Author_Institution
Fac. of Eng., Hiroshima Univ., Japan
fYear
1997
fDate
28-31 Jan 1997
Firstpage
221
Lastpage
226
Abstract
The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modification of wiring and compaction, and (iv) routing on inside layers
Keywords
circuit CAD; network routing; printed circuit design; printed circuit layout; MULTI-PRIDE; circuit bipartition; compaction; multi-layered printed wiring board design; outside layer; placement; routing; wiring; Capacitors; Circuits; Compaction; Design engineering; Resistors; Routing; Systems engineering and theory; Wires; Wiring; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location
Chiba
Print_ISBN
0-7803-3662-3
Type
conf
DOI
10.1109/ASPDAC.1997.600124
Filename
600124
Link To Document