Title :
Electroluminescence of silicon-rich silicon nitride light-emitting devices
Author :
Li, Dongsheng ; Huang, Jianhao ; Yang, Deren
Author_Institution :
Dept. of Mater. Sci. & Eng., Zhejiang Univ., Hangzhou
Abstract :
Non-stoichiometric silicon nitride films with different excess Si concentrations were deposited by plasma-enhanced chemical vapor deposition (PECVD) under different NH3/SiH4 gas flow ratios. Room-temperature electroluminescence (EL) was observed from the films. And the peak of EL spectra remains at 600 nm, irrespective of the increase of the Si concentrations. It was found that at high electric fields the electrons were injected into the SRSN film via Fowler-Nordheim tunneling and trap assisted tunneling, while at low electric fields the electrons were injected via Poole-Frenkel conduction. The observed EL can be attributed to the relaxation of injected carriers down the lower defect states before recombination due to their longer recombination lifetime.
Keywords :
MIS devices; Poole-Frenkel effect; aluminium; carrier relaxation time; defect states; electroluminescence; electroluminescent devices; electron-hole recombination; elemental semiconductors; indium compounds; light emitting diodes; optical films; plasma CVD coatings; silicon; silicon compounds; stoichiometry; tunnelling; Fowler-Nordheim tunneling; ITO-SiN-Si-Al; MIS device; NH3-SiH4 gas; PECVD; Poole-Frenkel conduction; SRSN film; carrier relaxation; defect states; electroluminescence; electron injection; nonstoichiometric silicon nitride film; plasma-enhanced chemical vapor deposition; recombination lifetime; silicon-rich silicon nitride light-emitting device; temperature 293 K to 298 K; trap assisted tunneling; Chemical vapor deposition; Electroluminescent devices; Electrons; Fluid flow; Plasma chemistry; Plasma devices; Semiconductor films; Silicon; Spontaneous emission; Tunneling;
Conference_Titel :
Group IV Photonics, 2008 5th IEEE International Conference on
Conference_Location :
Cardiff
Print_ISBN :
978-1-4244-1769-8
Electronic_ISBN :
978-1-4244-1768-1
DOI :
10.1109/GROUP4.2008.4638117