• DocumentCode
    3014126
  • Title

    Modeling and characterization of CNT-based TSV for high frequency applications

  • Author

    Kannan, Sukeshwar ; Kim, Bruce ; Gupta, Anurag ; Noh, Seok-Ho ; Li, Li ; Cho, Sang-Bock

  • Author_Institution
    Department of Electrical and Computer Engineering, The University of Alabama, Tuscaloosa, USA
  • fYear
    2012
  • fDate
    20-23 May 2012
  • Firstpage
    1584
  • Lastpage
    1589
  • Abstract
    This paper presents modeling and characterization of CNT-based TSVs for high frequency applications. We have developed an integrated model of CNT-based TSVs by incorporating quantum confinement effects of CNTs along with kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as monolithic microwave capacitor by resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine optimized configuration for TSV-based CNTs for radar applications.
  • Keywords
    Integrated circuit modeling; Mathematical model; Quantum capacitance; Substrates; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
  • Conference_Location
    Seoul, Korea (South)
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-0218-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2012.6271556
  • Filename
    6271556