DocumentCode
3014126
Title
Modeling and characterization of CNT-based TSV for high frequency applications
Author
Kannan, Sukeshwar ; Kim, Bruce ; Gupta, Anurag ; Noh, Seok-Ho ; Li, Li ; Cho, Sang-Bock
Author_Institution
Department of Electrical and Computer Engineering, The University of Alabama, Tuscaloosa, USA
fYear
2012
fDate
20-23 May 2012
Firstpage
1584
Lastpage
1589
Abstract
This paper presents modeling and characterization of CNT-based TSVs for high frequency applications. We have developed an integrated model of CNT-based TSVs by incorporating quantum confinement effects of CNTs along with kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as monolithic microwave capacitor by resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine optimized configuration for TSV-based CNTs for radar applications.
Keywords
Integrated circuit modeling; Mathematical model; Quantum capacitance; Substrates; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location
Seoul, Korea (South)
ISSN
0271-4302
Print_ISBN
978-1-4673-0218-0
Type
conf
DOI
10.1109/ISCAS.2012.6271556
Filename
6271556
Link To Document