DocumentCode
3014282
Title
Low threading-dislocation-density Ge film on Si grown on a pitting Ge buffer layer
Author
Cheng, B.W. ; Xue, H.Y. ; Hu, D. ; Han, G.Q. ; Zeng, Y.G. ; Bai, A.Q. ; Xue, C.L. ; Luo, L.P. ; Zuo, Y.H. ; Wang, Q.M.
Author_Institution
State Key Lab. on Integrated Optoelectron., Chinese Acad. of Sci., Beijing
fYear
2008
fDate
17-19 Sept. 2008
Firstpage
140
Lastpage
142
Abstract
A Ge layer with a pitting surface can be obtained when the growth temperature is lowered to 290degC. On the low temperature Ge buffer layer with pits, high quality Ge layer was grown at 600degC with a threading dislocation density of ~1times105cm-2. According to channeling and random Rutherford backscattering spectrometry spectra, a chimin value of 10% and 3.9% was found, respectively, at the Ge/Si interface and immediately under the surface peak. The root-mean-square surface roughness of Ge film was 0.33 nm.
Keywords
Rutherford backscattering; dislocation density; elemental semiconductors; germanium; semiconductor thin films; surface roughness; Ge-Si; Rutherford backscattering spectra; channeling; root-mean-square surface roughness; temperature 290 degC; temperature 600 degC; threading dislocation density; Buffer layers; Crystallization; Etching; Germanium silicon alloys; Optical films; Rough surfaces; Semiconductor films; Silicon germanium; Surface roughness; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Group IV Photonics, 2008 5th IEEE International Conference on
Conference_Location
Cardiff
Print_ISBN
978-1-4244-1769-8
Electronic_ISBN
978-1-4244-1768-1
Type
conf
DOI
10.1109/GROUP4.2008.4638124
Filename
4638124
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