A thermal management system and prototyping for system-on-chip designs

Author

Chiueh, Hemzing ; Draper, Ffrey ; Choma, John, Jr.

Author_Institution

Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA

fYear

2001

fDate

2001

Firstpage

51

Lastpage

55

Abstract

A thermal management system for system-on-chip (SOC) design and its prototype are presented. This paper proposes the architecture, design details with justification, and the final system integration for a complete thermal management system for SOC design. By embedding the proposed system in system-on-chip designs, stability and performance can be strengthened through optimal management of each component´s power using feedback from thermal information. This technique yields one generation of improvement in modern processor or other high-speed circuit design using the same silicon process

Keywords

application specific integrated circuits; circuit stability; high-speed integrated circuits; integrated circuit design; integrated circuit packaging; thermal management (packaging); circuit stability; feedback; high-speed circuit design; prototyping; system-on-chip designs; thermal management system; Circuit stability; Circuit synthesis; Energy management; Feedback; Power system management; Prototypes; Silicon; System-on-a-chip; Thermal management; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed-Signal Design, 2001. SSMSD. 2001 Southwest Symposium on

Conference_Location

Austin, TX

Print_ISBN

0-7803-6742-1

Type

conf

DOI

10.1109/SSMSD.2001.914936

Filename

914936