Effects of integrated circuit packaging on performance of a LNA in a mixed-signal circuit environment

Low cost and low packing densities are the most important considerations in design and manufacture of modern electronics. This has resulted in new design tools and electrical analysis tools for this new generation of circuits. This design technology is called mixed-signal design. The packages used for such applications are the high end, high I/O pin packages, which have considerably smaller package impedance to reduce power dissipation in the package and also trace lengths are much smaller so as to reduce coupling between adjacent signal lines. Ball Grid Array (BGA) packages along with other Chip Scale Packages (CSP) are the packages of choice for high end, high I/O packages. Certain high I/O Small Outline Packages (SOP) are also being used for such applications. Different package types provide different amounts of crosstalk through different components that makeup an integrated circuit package. Substrate coupling noise along with the package parasitic associated with packages used for these applications is the center of study in this paper