Title :
GaAs-Ge materials integration for electronic and photonic applications
Author :
Chia, C.K. ; Sridhara, A. ; Suryana, M. ; Dong, J.R. ; Wang, B.Z. ; Dalapati, G.K. ; Chi, D.Z.
Author_Institution :
Inst. of Mater. Res. & Eng., Agency for Sci., Singapore
Abstract :
Antiphase domain defects free GaAs layers grown on Ge(100) offcut substrates with and without an ultra thin AlAs interfacial layer were investigated. SIMS measurements suggest cross-diffusion of Ge, Ga and As atoms at the GaAs/Ge interface has significantly reduced with the presence of the thin AlAs layer. Photoluminescence (PL) measurements suggest complete elimination of PL originated from Ge-based complexes for structure with AlAs interfacial layer. The GaAs/Ge hybrid materials integration will find various applications such as in multijunction photovoltaics, metal-oxide-semiconductor-field-effect-transistors and ultra-low noise avalanche photodiodes. Circular mesas were etched on the GaAs/AlAs/Ge structure and the AlAs layer was oxidized and GaAs-on-insulator-on-Ge structure was demonstrated.
Keywords :
III-V semiconductors; aluminium compounds; chemical interdiffusion; elemental semiconductors; etching; gallium arsenide; germanium; multilayers; oxidation; photoluminescence; semiconductor-insulator-semiconductor structures; silicon-on-insulator; superconducting epitaxial layers; Circular mesas; GaAs-AlAs-Ge; Ge(100) offcut substrates; antiphase domain defects; etching; hybrid materials; interdiffusion; metal-oxide- semiconductor-field-effect-transistors; multifunction photovoltaics; oxidation; photoluminescence; ultra thin interfacial layer; ultra-low avalanche photodiodes; Atomic layer deposition; Atomic measurements; Avalanche photodiodes; Gallium arsenide; Industrial electronics; MOCVD; Monolithic integrated circuits; Optical devices; Photovoltaic cells; Temperature;
Conference_Titel :
Group IV Photonics, 2008 5th IEEE International Conference on
Conference_Location :
Cardiff
Print_ISBN :
978-1-4244-1769-8
Electronic_ISBN :
978-1-4244-1768-1
DOI :
10.1109/GROUP4.2008.4638177