DocumentCode
3015333
Title
Influence of MOS transistor gate oxide breakdown on circuit performance
Author
Yeoh, Teong-San ; Hu, She-Jer
Author_Institution
Intel Technol. Sdn. Bhd., Penang, Malaysia
fYear
1998
fDate
1998
Firstpage
59
Lastpage
63
Abstract
MOS transistor gate oxide breakdown is a common failure mechanism which needs to be understood in terms of its impact on circuit performance. Studies have shown that post MOS transistor gate oxide breakdown forms a phosphorous diffusion path in the gate oxide. This diffusion path originates from the phosphorous doped polysilicon gate. The effect of p- and n-channel gate oxide breakdown on the functionality of a four-inverter chain circuit is studied through SPICE simulations. Gate-to-drain oxide breakdown of either p- or n-channel transistors was found to significantly degrade overall circuit performance
Keywords
MOS logic circuits; MOSFET; SPICE; circuit simulation; dielectric thin films; diffusion; failure analysis; integrated circuit modelling; logic gates; semiconductor device breakdown; semiconductor device models; MOS transistor gate oxide breakdown; SPICE simulation; Si; Si:P-SiO2-Si; circuit performance; diffusion path; failure mechanism; four-inverter chain circuit; functionality; gate oxide; gate-to-drain oxide breakdown; n-channel gate oxide breakdown; n-channel transistors; p-channel gate oxide breakdown; p-channel transistors; phosphorous diffusion path; phosphorous doped polysilicon gate; post MOS transistor gate oxide breakdown; Analytical models; Circuit optimization; Circuit simulation; Diodes; Electric breakdown; Inverters; MOSFETs; SPICE; Transient analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 1998. Proceedings. ICSE '98. 1998 IEEE International Conference on
Conference_Location
Bangi
Print_ISBN
0-7803-4971-7
Type
conf
DOI
10.1109/SMELEC.1998.781150
Filename
781150
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