• DocumentCode
    3015610
  • Title

    Beam structure for CMUT with desired frequency spectrum

  • Author

    Tanaka, Hiroki ; Azuma, Takashi ; Machida, Shuntaro ; Hashiba, Kunio ; Kobayashi, Takashi

  • Author_Institution
    Central Res. Lab., Hitachi, Ltd., Tokyo
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    500
  • Lastpage
    503
  • Abstract
    Capacitive Micro-machined Ultrasound Transducers (CMUTs) with beam structures independently control resonance frequency and fractional band width (FBW). We used a theoretical approach to calculate equivalent stiffness and mass with CMUT diaphragm with rectangular beams. We also investigated the relationship between a base diaphragm´s thickness and width and those of beams in terms of resonance frequency, FBW and collapse voltage. We found that a CMUT´s frequency spectrum can be controlled merely by controlling base diaphragm and beam thickness. To effectively change the frequency spectrum, the beam width is made as small as possible compared with the pitch of the beams. We examined a simple three-dimensional (3-D) model in which rectangular beams were placed on a uniform rectangular diaphragm aligned in one direction with constant pitch and compared its characteristics to those obtained with theoretical approach. The resonance frequency and collapse voltage calculated by the theoretical model showed good agreement with those obtained with the 3-D model. We concluded that beam structures are one means of enabling CMUTs to be designed more freely.
  • Keywords
    capacitive sensors; diaphragms; micromachining; microsensors; spectral analysis; ultrasonic transducers; CMUT beam structure; CMUT diaphragm; capacitive micromachined ultrasound transducer; collapse voltage; equivalent stiffness calculation; fractional band width; frequency spectrum; rectangular beams; resonance frequency; uniform rectangular diaphragm; Acoustic beams; Damping; Laboratories; Material properties; Resonance; Resonant frequency; Shape; Thickness control; Ultrasonic imaging; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0122
  • Filename
    4803160