• DocumentCode
    3016072
  • Title

    Frequency response of a micromachined doubly-clamped vibrating beam for the measurement of liquid properties

  • Author

    Riesch, Christian ; Keplinger, Franz ; Reichel, Erwin K. ; Jakob, Bernhard

  • Author_Institution
    Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Vienna
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    1022
  • Lastpage
    1025
  • Abstract
    We recently presented a micromachined doubly clamped vibrating beam sensor for measuring viscosity and density of liquids. The beam vibrations are excited by Lorentz forces arising from a sinusoidal current through an integrated conductive path. An optical readout allows determining the phase shift between the excitation current and the actual beam deflection. The interaction between the vibrating beam and the surrounding liquid alters the resonance behavior. In a modeling approach, a simple harmonic oscillator model was fit to the beam´s frequency response. However, this model does not account for the frequency dependence of the liquid loading. An improved model based on the hydrodynamic function of a beam with rectangular cross-section has been fit to the measurement results. The resulting parameters yield a very high intrinsic damping parameter, indicating the presence of other damping effects not yet considered by the model.
  • Keywords
    crystal resonators; density; liquids; microsensors; surface acoustic wave sensors; vibrations; viscosity measurement; Lorentz forces; beam deflection; beam frequency response; beam vibrations; excitation current; integrated conductive path; liquid density; liquid viscosity; micromachined doubly clamped vibrating beam sensor; optical readout; simple harmonic oscillator model; sinusoidal current; Damping; Density measurement; Frequency measurement; Frequency response; Liquids; Optical sensors; Oscillators; Resonance; Vibration measurement; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0247
  • Filename
    4803181