Title :
Wafer-level packaged SAW filters with resistance to transfer molding
Author :
Fukano, Tom ; Okubo, Yoshihiro ; Nishii, Junya ; Obara, Ikuo
Author_Institution :
R&D Center, Kyocera Corp., Seika
Abstract :
A wafer-level-packaging technology is proposed to realize small SAW filters with low profiles that are resistant against transfer molding. Structural design considerations are described as well as the experimental results. It is shown that the proposed WLP SAW filters are suitable for the applications to RF front-end modules which are transfer molded with ICs.
Keywords :
surface acoustic wave filters; transfer moulding; wafer level packaging; IC; RF front-end modules; SAW filters; structural design; transfer molding; wafer-level-packaging technology; Acoustic waves; Chip scale packaging; Resins; SAW filters; Space technology; Surface acoustic waves; Temperature; Testing; Transfer molding; Wafer scale integration; component; surface acoustic wave; transfer molding; wafer-level-packaging;
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
DOI :
10.1109/ULTSYM.2008.0026
