DocumentCode
3016380
Title
Wafer-level packaged SAW filters with resistance to transfer molding
Author
Fukano, Tom ; Okubo, Yoshihiro ; Nishii, Junya ; Obara, Ikuo
Author_Institution
R&D Center, Kyocera Corp., Seika
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
108
Lastpage
111
Abstract
A wafer-level-packaging technology is proposed to realize small SAW filters with low profiles that are resistant against transfer molding. Structural design considerations are described as well as the experimental results. It is shown that the proposed WLP SAW filters are suitable for the applications to RF front-end modules which are transfer molded with ICs.
Keywords
surface acoustic wave filters; transfer moulding; wafer level packaging; IC; RF front-end modules; SAW filters; structural design; transfer molding; wafer-level-packaging technology; Acoustic waves; Chip scale packaging; Resins; SAW filters; Space technology; Surface acoustic waves; Temperature; Testing; Transfer molding; Wafer scale integration; component; surface acoustic wave; transfer molding; wafer-level-packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0026
Filename
4803198
Link To Document