DocumentCode :
3017127
Title :
Fabrication and operation of microplasma reactor array for maskless nanoscale material etching
Author :
Han Xie ; Li Wen ; Hai Wang ; Jiaru Chu
Author_Institution :
Dept. of Precision Instrum. & Precision Machinery, Univ. of Sci. & Technol. of China, Hefei, China
fYear :
2013
fDate :
5-8 Aug. 2013
Firstpage :
1180
Lastpage :
1183
Abstract :
This paper reports a novel maskless nanoscale material etching method based on microplasma reactor array with advantages of high etching efficiency, high fidelity, simple-structure, and flexible to etching various material. A 2×2 inverted pyramidal microplasma reactor array with each cavity dimension of 50μm was successfully fabricated by MEMS process. Experiment results showed that the devices could operate in rare gas Ar under dc excitation. V-I characteristics of the microplasma reactor array at 10kpa of Ar with different ballast resistances were presented. The work in this paper may lay a good foundation for maskless nanoscale material etching.
Keywords :
argon; discharges (electric); microcavities; microfabrication; microreactors; plasma chemistry; plasma devices; sputter etching; Ar; MEMS process; V-I characteristics; ballast resistances; cavity dimension; dc excitation; high etching efficiency; high fidelity efficiency; inverted pyramidal microplasma reactor array; maskless nanoscale material etching method; microplasma reactor array fabrication; microplasma reactor array operation; rare gas Ar; simple-structure; size 50 mum; Arrays; Discharges (electric); Electronic ballasts; Etching; Inductors; Materials; Nanoscale devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology (IEEE-NANO), 2013 13th IEEE Conference on
Conference_Location :
Beijing
ISSN :
1944-9399
Print_ISBN :
978-1-4799-0675-8
Type :
conf
DOI :
10.1109/NANO.2013.6720934
Filename :
6720934
Link To Document :
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