DocumentCode :
3017613
Title :
Small-sized SAW duplexers with wide duplex gap on a SiO2/Al/LiNbO3 structure by using novel Rayleigh-mode spurious suppression technique
Author :
Nakanishi, H. ; Nakamura, H. ; Hamaoka, Y. ; Kamiguchi, H. ; Iwasaki, Y.
Author_Institution :
Corp. Components Dev. Center, Panasonic Electron. Devices Co., Ltd., Osaka
fYear :
2008
fDate :
2-5 Nov. 2008
Firstpage :
1588
Lastpage :
1591
Abstract :
This paper describes the novel Rayleigh-mode spurious suppression technique for SAW duplexers with wide duplex gap on a SiO2/Al/LiNbO3 structure. We have cleared the optimum shape of SiO2 with taking account of the difference of the electrode thickness. The shape of SiO2 which can suppress the spurious depended on the thickness of Al electrode. By controlling the shape of SiO2, the Rayleigh-mode spurious of both Band I and Band IV duplexers can be suppressed. The small-sized SAW duplexers for Band I and Band IV systems were realized by employing this technology and optimizing the thickness of Al electrode. Our duplexers show the excellent performances for actually use. Insertion loss of transmitting band for Band I and for Band IV are 1.2 dB and 1.3 dB. And, the TCF is about -30 ppm/degC. The size of these duplexers is 2.5 mm times 2.0 mm. Additionally, the duplexers have sufficient power durability by using the multi-layer electrodes of AlMgCu/Ti.
Keywords :
aluminium; aluminium alloys; copper alloys; electrodes; lithium compounds; magnesium alloys; multilayers; multiplexing equipment; silicon compounds; surface acoustic wave devices; titanium; AlMgCu-Ti; Band I duplexer system; Band IV duplexer system; Rayleigh-mode spurious suppression technique; SiO2-Al-LiNbO3; insertion loss; multilayer electrodes; power durability; small-sized SAW duplexers; wide duplex gap; 3G mobile communication; Artificial intelligence; Attenuation; Circuits; Electrodes; Frequency; Insertion loss; Propagation losses; Shape control; Surface acoustic waves; Band I; Band IV; Duplexer; Rayleigh-mode spurious; the shape of SiO2;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
Type :
conf
DOI :
10.1109/ULTSYM.2008.0387
Filename :
4803247
Link To Document :
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