• DocumentCode
    3018336
  • Title

    Standard bus vs. bus wrapper: what is the best solution for future SoC integration?

  • Author

    Yeung, C. ; Matthews, G. ; Morris, J. ; Haverinen, A. ; Zaidi, J.

  • Author_Institution
    VSI Alliance
  • fYear
    2001
  • fDate
    13-16 March 2001
  • Firstpage
    776
  • Lastpage
    776
  • Abstract
    A number of companies have promoted their on-chip busses as potential standards for the SoC industry. VSIA??s On-Chip Bus Development Working Group chooses to develop a Standard Bus Wrapper (VCI) as opposed to endorsing a single bus as the standard. Standard Bus advocates claim Wrappers incur performance and area overhead. Bus Wrapper advocates claim no single On-Chip Bus will meet the needs of all SoCs. Will a single bus emerge, and if not where should a standard wrapper be used? Which is the correct approach for future SoC Integration? This panel will include experts from both of these perspectives, to discuss the pros and cons of their positions.
  • Keywords
    Costs; Design methodology; Investments; Microelectronics; Microprocessors; Protection; Standards development; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2001. Conference and Exhibition 2001. Proceedings
  • Conference_Location
    Munich, Germany
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-0993-2
  • Type

    conf

  • DOI
    10.1109/DATE.2001.915119
  • Filename
    915119