Title :
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)
Abstract :
The following topics were dealt with. Thermal management simulation; measurement techniques; compact models; active cooling technology; thermal enhancement technology; and component thermal performance
Keywords :
cooling; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; thermal management (packaging); active cooling technology; compact models; component thermal performance; measurement techniques; thermal enhancement technology; thermal management simulation;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915125
